By utilizing its 3DFabric technologies, a family of 3D silicon stacking and cutting-edge packaging technologies, TSMC has announced the Open Innovation Platform (OIP) 3DFabric Alliance to assist customers in achieving quick implementation of silicon- and system-level innovations and enable next-generation HPC and mobile applications.
The sixth OIP Alliance from TSMC and the first of its type in the semiconductor sector, the new alliance joins forces with partners to speed up innovation and preparedness in the 3D IC ecosystem, the foundry company stated. It was announced at the 2022 Open Innovation Platform Ecosystem Forum.
According to LC Lu, TSMC fellow and vice president of design and technology platform, “3D silicon stacking and advanced packaging technologies open the door to a new era of chip-level and system-level innovation, and they also require extensive ecosystem collaboration to help designers navigate the best path through the myriad options and approaches available to them.” “Through the combined leadership of TSMC and our ecosystem partners, our 3DFabric Alliance offers clients an easy and flexible method to harness the power of 3D IC in their designs, and we can’t wait to see the innovations they can build with our 3DFabric technology,” says the organization.
According to AMD Senior Vice President of Technology